High Density Circuit PCB

Product details

High density Circuit PCB means a compact circuit board, which is to increase component interconnect density, it is necessary to compress the circuit and interconnection space from a geometric perspective, allowing more connection points to be accommodated in a small area and thus improving interconnect density. Additionally, stacking multiple components in a single location can enhance assembly density. Therefore, high-density circuit boards are not just a circuit board technology, but also an issue related to electronic assembly and packaging.

 

To achieve increased circuit density, the diameter of laser holes and the target pads for receiving laser holes are shrinking. Some customers are engaged in mass production of products with a high-density design, featuring 175um target pads and 75um laser holes. This means that, excluding the etching amount for image transfer, the total offset across three processes - image transfer, pressing, and laser drilling - should be less than 40um.

 

If the offset exceeds the specified limit, the laser hole will shift off the target pad and onto the next layer, leading to the risk of short circuits after copper plating or CAF defects. High density Circuit PCB manufacturers fail to improve their alignment capabilities promptly, it will inevitably result in significant yield losses and pose severe challenges for them.

 

The industry generally uses HDI (High Density PCB) laser drilling technology to produce printed circuit boards with blind via designs. When customers have higher withstand voltage requirements, the dielectric thickness of the blind via layer needs to be relatively thick, or when the blind vias need to carry larger currents, the blind via diameters need to be larger. In such cases, conventional HDI techniques may not meet the customers' design requirements, and mechanical blind via design becomes a preferred choice.

 

For mechanical blind via PCBs, the commonly used processing method is to first create the through-hole connections in the blind via layer and fill the blind vias with resin plugs to ensure proper filling. Then, the inner layer circuitry is created, followed by lamination. After lamination, the outer layer is processed using a similar process to conventional multilayer boards.

 

So do you get meaning about high density circuit PCB(HDI board)?

 

http://www.bsinterconn.net/